I need to design that kind of pattern. The red pattern is component side,
the green pattern is the opposite side. Basically the layout of the component
is only defined on the component side, but I would like to have an exposed
pad also on the opposite side. How can I do that?
I thought I could define a copper fill area, but in this case, the area would
be covered with the board insulation layer, so it wouldn’t work.
NB: It’s a 5x5 laser driver for 3A CW operation, so it has to dissipate a lot
of power from the thermal pad. The only solution is to have a radiator on the
opposite side, and that’s why I wanted a thermal pad on the solder side.
How can this be done? Maybe by defining a thermal pad symbol and component?
Does anybody have an experience for that kind of high power component?
Thanks for any hint.