Hi
I have a few MOSFET where their thermal pads (drain) have to be connected to the cupper layer.
The package is a TO-220AB.
Do I have to create a new footprint and add a new pad for the thermal pad?
In that case, I would have 4 pads?
Thanks for your help.
Sadly such a footprint is missing in the official lib. (We only have TO-220 footprints for packages without a Tap.)
Depends on your mosfet.
If the Tap is connected to one of the other 3 pins you can just give this pad the same pin number as the pin it is connected to.
Otherwise you need to give it a separate pin number
Have a look at TO_SOT_Packages_SMD:TO-252-3_TabPin2
for inspiration. (Yes this is a SMD package but it shows the principle of how it can be done.)
Thanks for your replies.
I am using some IRFB4110. Pin2 and thermal pad are connected. So the LM7805 (TO-220_Horiz_ThermalPad.kicad_mod) is pretty similar and I will go for it
I like the fact that we can import _mod files into FreeCAD with the kicad StepUp tools. The representation in 3D is better with the different layers. However, the Pads numbers are not imported; probably complicated to achieve and not so important finally!