Thermal pad involving vias

[Naib]

@davidsrsb

I have use unplugged vias in pads, but do go for a 0.3mm hole to reduce solder theft

0.254mm hole and it still wicked and tilted

Include heatsinking vias of footprint to GND area

Well… when it comes to the design there is only one type… putting a via in a pad. When it comes to the fabrication this is where the distinction comes as you may or may not want/need to fill said vias. The reason I am stressing the distinction is no eCAD tool nor fabrication format (GERBER,ODB++) contains information as to whether you want to fill the via’s and which one or with what epoxy. such information is part of the fabrication datapack Also, I disagree that with big thermals pads that t…