Well… when it comes to the design there is only one type… putting a via in a pad.
When it comes to the fabrication this is where the distinction comes as you may or may not want/need to fill said vias. The reason I am stressing the distinction is no eCAD tool nor fabrication format (GERBER,ODB++) contains information as to whether you want to fill the via’s and which one or with what epoxy. such information is part of the fabrication datapack
Also, I disagree that with big thermals pads that there is plenty of solder and thus the wicking isn’t a problem. I have a design from 2 years ago where I did not request tenting via’s and a uModule lifted due to the wicking…
–edit–
extracted one of the images from my MantisBT setup.
One out of the 5 cards hard open-circuit due to the tilt. 2 had good connections and two had “suspect”, all determined via xray
tl;dr it isn’t a problem to just be dismissed and it is always advisable that people are aware of the ramifications so they can make an informed decisions