I have a four layer board with plated through vias. What I expect is if the net is unused on a given layer then the hole should not have a pad around it, but a simple test with a one resistor layout shows pads around the drill holes on every layer when I view the exported gerbers.
This image illustrates what I am after. A: Is what I’m trying to get, B: is what I’m getting. My trace for the example hole only goes to the top and bottom layers so I don’t need the pads on the inner layers
Likewise if I have a trace from the top to the first inner layer then I would not want pads on the second and bottom layers. Am I missing some important aspect of how vias are manufactured again?
For my design I need every micrometer I can get so am hoping if I can get rid of those inner pads I can increase the clearance on the inner layers.