Hm.. quick-fix - place a no-fill zone in the size of the footprint (roughly where the vias are) on the pcb?
I don’t think you will be able to ‘transplant’ something like this into the footprint unfortunately:
(zone (net 0) (net_name “”) (layer F.Cu) (tstamp 5697C758) (hatch edge 0.508)
(connect_pads (clearance 0.3))
(min_thickness 0.2)
(keepout (tracks allowed) (vias allowed) (copperpour not_allowed))
(fill (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
(polygon
(pts
(xy 126 94.2) (xy 126 98.4) (xy 128 98.4) (xy 128 94.2)
)
)
)
EDIT: NOT WORKING..
One idea.. probably not working, but you can try..
Create a SMD pad, same/similar size as the zone I suggested in the footprint above.
Change it’s layer to something like Cmts.User only.
Maybe it keeps the fill out - fingers crossed.