That particular design was 0.24mm ( Include heatsinking vias of footprint to GND area - #13 by Naib) - tenting was accidently forgotten. Just pointing out its a real issue and sure smaller should mitigate it but sometimes you can’t go smaller due to aspect ratio and thus being mindful of wicking is always wise and then you can make an informed decision.
Even if kicad could, the issue would be how to present the need to the fabricator. The only method I use for selective-tenting or filled via’s is a specific via size (even if it is a silly decimal-place difference) and inform the fab “all vias of 0.240001 are to be filled” OR a selective region as part of a drawing pack