How to specify pinsockets in place of modules

[dougmo52]

I am using two modules, a DRV8825 and an RP2040-ZERO. Both have TH footprints for soldering.

It is easy to replace the DRV8825 footprint with a pair of 1x8 2.54 pin sockets. But the RP2040-ZERO is a bit more challenging in DRC. I can place a pair of 1x9 2.54 pinsockets and a single 1x5 2.54 pinsocket in the schematic and arrange them on the board in the required horseshoe shape, but doing so makes the DRC flag the places the pinsocket footprint silkscreens overlap. I can edit the footprints and remove the silkscreens and possibly courtyards, but I am unsure how that effects manufacture.

Is there a way to nopop the modules and instead specify the placement of appropriate pinsockets using the available module footprints during board manufacture? I may try PCBWay for this board as it is conveniently coupled to KiCad tools.

[der.ule]

Hello, if the courtyards are also signaled, try using the 3D Viewer to see if there are real collisions or only cosmetic ones, if the collisions are only cosmetic (Silkscreen) you can ignore them, you can edit them out if you like, or ignore the DRC or set the DRC to ignore that warning.

I hope this helps

[RaptorUK]

This topic has been discussed a lot in the last few months . . . please read some of the existing threads.

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[bidrohini]

The RP2040-ZERO’s unique horseshoe-shaped pin layout makes it tricky, especially with overlapping silkscreens from multiple socket footprints.

Create a single custom footprint that represents the entire horseshoe layout of pin sockets (1x9 + 1x9 + 1x5). This avoids overlapping silkscreens/courtyards.
In the footprint, place TH pads where the pin headers will go.
Include only one courtyard and one silkscreen outline (simplified).
Name the footprint something like Socket_RP2040_ZERO_Horseshoe.

This avoids DRC errors without editing standard library parts or dealing with overlapping courtyards/silkscreens.

If you want, I can help generate a .kicad_mod footprint file or walk you through it.

[dougmo52]

Thank you for your response. I can create the footprint OK.

The existing RP2040-ZERO footprint passes ERC. I can put in pin sockets instead of the module in the 3D model. It seems like I should be able to specify the same be done if I send the files to a board house for manufacture.

If I create a model, what specifies what parts get installed? For example, a pin header and a pin socket footprint look pretty much the same. What tells the mfg which part to use?

[eelik]

@dougmo52

What tells the mfg which part to use?

Do you mean you will order an assembled board? In that case you have to follow their process and send them the BOM and placement file. If there are several physical parts to assemble you should identify them clearly in the BOM and in the board. For example, if you decide to use one symbol + one footprint you can add extra reference designators to the board and draw the pin socket outlines in the silkscreen. The same reference designators must be in the BOM.

However, you should first know how much it costs and if you really want those parts to be assembled there. It may be much, much cheaper to solder them at home manually unless you have many boards. If you will solder them yourself but let the factory assemble other parts, it doesn’t matter how they are marked in the board. You just leave them out from the BOM.

In any case, it’s mandatory to get familiar with their offerings and requirements. Don’t ask here, ask them, and only after reading their existing documentation. There’s no one standard in the assembly process, everything except the actual physical machine placing the parts one by one on the board and then soldering it in the oven requires manual work – even file and data processing. Their process differs from other factories’ processes.