The drawing I see on page 5 of that document is the package outline drawing, not the footprint. Be careful when you look at that sketch: the three views are NOT an orthogonal set. They show you top, side, and bottom views rather than top, front, and side. (Or do you call them plan, front elevation, and side elevation views?) And, the side view is drawn from the opposite viewing direction to what I learned in High School and college drafting classes.
The footprint information is shown toward the bottom of page 6.
The footprint sketches on page 6 show three of the layers found in a typical footprint. On the left is the copper layout to which the component will be soldered. In the center is the recommended solder mask layer. On the right you see the apertures for the solder paste stencil.
No silkscreen layer is shown. You can make life a little easier for a few people (including yourself) by intelligently adding some information on the silkscreen.
No information is given for the back-side layers. If you poke around Osram's web site you should discover a document or two that show you why a little copper on the back side is a good idea. (If not, shame on Osram! Usually, you will find at least a mention of this topic in the data sheet, though the details are often relegated to a separate document due to the complexity of the topic.)
KiCAD creates a soldermask layer based on the board outline, any copper fill zones, and pads defined in the copper layers. At worst you need to specify a value for the "soldermask swell" or "mask pullback" parameter. This soldermask layer created by KiCAD is typically quite reasonable and effective as long as you have simple, commonplace, pads in the solder layers.
This component does not have simple, commonplace, pads in the solder layers. You will have to explicitly draft this component's soldermask layer, and modify parameters for this component's pads. (And do much the same thing for the solderpaste layer, if it is needed.)
I suggest that you make an honest attempt to draft a footprint for this component, post that footprint here, and ask for comments. If it appears that your effort was sincere and rational, the responses will be respectful, forthright, and helpful. "Initiative" is a highly admired quality around here.