Trying to work out how these thermal vias work on the footprint:
I put a GND pour on the back of the board but the back copper pad that’s part of the footprint is unable to be connected to the GND layer even if I set the pad to the GND net. The TI datasheet for the LMR16030 says that the thermal vias need to be connected to a GND plane.
The vias aren’t connected to the GND net on the back of the board:
Even if I set pad 9 to GND net there is no connection to GND on the back:
I am also a bit confused about solder wicking. A few posts I have read say that you need to be careful of the solder wicking down the via to the back leaving no solder under the TI PowerPad.