I’ve been able to easily create copper heatsink for electrically connected pads of smt components, using the fill zone tool and associating the filled zone to the appropriate electrical net name.
However, I’m a bit lost on how to procede in the case I want to connect a copper heatsink on the pad 4 of a Package_TO_SOT_SMD:SOT-223 that have, by default, no electrical role, hence no electrical connection.
For that package, in fact, the pad number 4 is there just for its thermal and mechanical utility.
Nevertheless, if I try to create a fill zone around that pad, I end up, despite all the options I choose (Fill zone, no THT nor Thermal relief), with having that unwanted clearance evidenced by the yellow line in the image below
What’s wrong with my approach? I’ve also tought to manually adjust the pad dimension changing its properties, still, this doesn’t sound as the “formally corrected” approach to me. Any help please?