Sorry, this pads were not connected at any of images you uploaded in your first post. Not only first post, but all posts until post 24.
In such design (charging/discharging battery) you need not to connect extra these GND pads with vias and GND zone at top layer. But it is worth to learn good practices from beginning.
But look how solid are the current pads of current sensing resistor and how thin is your track you draw that current. Remember: if you do not order a special PCB, the PCB has copper that is only 0.035mm thick.
Your tracks driving MOS Gates (current is zero, zero, nothing) are wider that your track driving the battery discharge current. I would not route track connecting these MOS Source pads under them but out of them were I can use wider track, even if having to route Gate tracks through vias.
If you want to know where from the need to use solid (not interrupted by other tracks) GND zone comes then read the articles I have linked here in 2020:
Do not copy my text that it looks as you have written it. I know where is the end of my text and where starts yours but others can be confused. When you select a piece of someone else’s text you have the option to Quote it and it is inserted into your post with clear info who have written it.
Enter the edition of zone you have placed. You there have layers list at which zone is to be made. Mark checkbox next to F.Cu. Zone will be made also at top layer.
You need not to route this pads wire by wire. I am placing via (using tool from right toolbox) near the GND pad and then connect pad to this via. As you have zone also at bottom you need not even to connect these pads to these vias. But placing via near any GND pad gives for the return currents going through the GND the short connection to good, solid GND allowing each return current to select the lowest impedance way to its source.