I have a 4 layer board. I have a SMT part that has a center ground pad. I have routed it to a ground pin that then uses a via to get to layer 2 (my GND pour layer). Im thinking this isn’t correct, however. What is the proper way to get this ground plane layer 2?
Why do you think so?
Another possibility is the use of thermal vias, but there is the issue of possible solder wick.
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No intention to be intrusive, but I noticed you implement blind vias. I assume you are aware this infers significant additional cost and narrows your choice of board houses. JLCPCB e.g. does not do blind vias for their affordable prototype boards.
Ah, interesting point on the blind vias. I chose that because in Kicad it appeared to not let me select one of the inner layers without it being a blind via.
Running Kicad 7
Well, if you want to go to a distinct inner layer only, it IS a blind via. Normal vias go thru ALL layers, so no need to select one. If you route a track form say 1 and want to continue on 3, you have to press ‘+’ (layer sequencer) until 3 is active after hitting ‘V’ and then go on routing.
Or select the desired layer and start routing there (‘X’).
‘V’ will always alternate thru a set layer pair
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ah that makes sense. I guess you can tell this is my first 4 layer board. Always were 2 layers in the past. haha. Thank you!
You are welcome. We all started somewhere 
.
Going to 4 layers makes having a good ground/power plane easy. Or at least easier.
The additional cost (again for JLCPCB, btw. I am not their agent 
) is only a few bucks.
I will check them out as well. I have been using PCBWay in the past.
PCBway is expensive when it comes to 4 layer boards.
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For parts that I expect to dissipate a bit of power, I use both a top layer pour - without reliefs, AND a via array to help move heat down to my full ground plane.
Here’s an example of a 5 amp DC-DC converter - the vias are 0.3mm drills, and don’t seem to wick.
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