Maybe, maybe not. It depends on your manufacturing specs. Only you know what those are. To find out, you need to make a batch and monitor the quality.
Certainly, all fab houses have a minimum width for solder mask, frequently that means there is no mask between fine pitch pins. In practice, it doesn’t matter much, solder still sticks much better to copper than it does to bare FR4.
Yes, don’t get too hung up on paper specifications. The footprints in the datasheets are more like “serving suggestions”, they are one example that has a good chance of working in typical scenarios. In all cases you might need to adjust the specs according to your own manufacturing specs. But until you have some data from real manufacturing runs, there is no point in guessing.