Several questions related to Multilayer PCBs. Request the enlightened to clear the following:
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What is the difference between a via and a Micro (apart from the prime difference that a Through is between the surface layers only)?
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Q1 originates from a layout I have been doing today. This is a circuit with a lot of routing and I suspected whther two layers should be enough. I started with a four layered board, consciously reducing the need to go to other layers and ending playing only between F.Cu and In1.Cu. Initially, I found it tough and finally somehow could avoid tracks, components or vias to any other layer. Obviously in the process, I created a number of Micros. I then tried to finish off by swapping the In1.Cuwith B.Cu by just transferring all components to B.Cu from In1.Cu. This is where the questions arise. After the swap, I could see that all tracks got transferred to B.cu. Even the micros have been changed (their terminal layer changed from In1.Cu to B.Cu wherever needed). But the type of the Via remained to be a Micro
So now, did I need to change all the Via types to “Through”? Can I allow them to remain “Micro”. What difference does it make? To the Gerber and to the manufacturer?
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During the DRC, I saw a good number of errors, which were explained with messages starting with an ErrType code. Can someone please help me locate these error codes and their interpretation? (I am aware that the accompanying message also contains sufficient detail, but just wondering if the ErrType codes are a gateway to more information).
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Can I have a hole with padding on just one side of the board? I tried to use the Through hole Wire pads but they ended up adding pads on both layers. I need layers on only one.
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For placing screws on the corners for example, do I always need to use a Via? Can I indicate it on the board using another method, which does not need electroplating?
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When choosing a footprint for a symbol, in the footprint browser, we cannot use the Ruler tool. Is there a plan for the EESchema to allow the Ruler tool on the Footprint selector?
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I am loving the PCBNew. But the documentation seems very out of synch with the actual software (5.0.2). How can I help update the observations without affecting the quality?
Please help…
Regards
Rahul