Hi all!
I am designing a PCB with a BGA (0.5mm pitch, 0.3mm diameter balls). To escape some of the balls I need to use via-in-pad, but when I try to place my via on the pad I get “Via location violates DRC” and am unable to place it. I have played around with the constraints in the board properties, but I cannot find a specific constraint that controls the distances vias need to be from pads (which I suppose is what this warning is about). I think it may also have to do with the proximity to other pads. How can I allow via-in-pad for my design? Here is a screenshot of my situation: