Hello there,
I have a hatched copper fill. When I place vias KiCad decides to solid fill the area around the via. I can not find an option where I can modify the radius around the via for the solid fill.
Does anybody have a solution to reduce the radius or turn it off completely?
So I’ve just observed that reducing the hatch gap also reduces the radius of the solid fill around the via. Therefore I think that the radius can not be manualy set but is set by KiCad correlating to the hatch gap.
I guess this is worthy of improving/changing, as this kills my use case for RF design completely and I will have to draw the hatch by hand to avoid the solid fill.
Does anybody have a different solution?
This may be a bug, at least in my opinion it is. You can report it to the issue database. If the developers agree, it’s possible it will be fixed quickly and available in the stable branch “testing builds” immediately and then in the next dot release.
