The footprint already has a version with straight pin headers but I need to use 90 degree pin headers on the IN- and Out- pads. I’m thinking of making In+ and Out+ connections via cable. In this case, how can I modify the footprint design? Thank you for your help.
Looks like you need to make your own new footprint. There’s no relation between the horizontal footprint and the vertical one. You just need to measure the module to work out where the TH pads should go and where they are relative to the courtyard. Opportunity for you to learn the Footprint Editor. Remember that the height of those capacitors influence the courtyard.
Those buck modules differ in layout from model to model. Make sure you have enough stock for all the boards you intend to assemble.
I couldn’t express what I wanted correctly. I need to better understand the relationship between the footprint and the 3D model. I want to rotate the 3D model, not the footprint. The footprint will remain horizontal on the PCB, and of course, I need to edit it. I believe I can rotate the 3D model with FreeCAD. I’ll try these. Thank you.
On the other hand, KiCad itself rotates and shifts the 3D model, as if there is no need to do anything with FreeCAD. (scales as well for fine dimensioning! )
In cases like this I usually use relatively thick copper wires and solder them in diagonally to the “top holes” To make the 3D model “complete” the best option probably is to import it in a 3D CAD program, and do the rotation and addition of extra wires in there, and then re-export.
Long time ago due to space constraints I used vertical DCDC module but designed by me. As In- and OUT- were connected (and you probably also have it connected) my module had simply 3 pin horizontal pin-header at its bottom PCB edge (GND between In and OUT).