Venting about changed 0603 footprint

Hi, I’m updating an old board that I had done with KiCad 4 or 5 and fabricated with a few issues I now fixed. I got DRC violations that my footprints doesn’t match the library ones in KiCad 7. I’m mostly just intrigued and want to make an informed decision if I should keep or change them all up for this next revision.

Just to show what I mean super clear, so these are the violations warnings:

I figured I wanted to update them all to keep this board up-to-date with KiCad std lib:

and here is the change on the board:

The right one being the new one is a lot rounder than the old one. I hadn’t really noticed this change before to the std lib.The roundness helps with pad-tear?

I guess I should dig into change logs, but this could be a really old change so figured I could ask here, maybe common knowledge?

I’ve read that the rounded pads have a benefit in letting the solder flow more evenly onto the pad when soldering. The sharp corners can sometimes be problematic.

This one came in around V6.
The reduced spacing caused me a lot of changes where I had used the resistor to jump tracks

Rounded corners also reduce solder whisker formation

I think it’s from more closely following a proposed IPC standard (draft info here & here).

Apparently, “trying to find the rationale” is just code for venting. Maybe close this thread.