Hi all. I’m creating a project in PCBNew using a touch pad that I created by using the square tool and filling it in with copper and creating a layer mask for the same shape so that the copper will be on the surface. No problem there. I want to connect this pad to an SMD resistor on the bottom and here is my question:
When I place a via to do this on the pad, the connection is made on the top (pad side) and I can then draw the track to the resistor on the bottom. When I go to fill zone the (B) design, there is a space created around the via so that it won’t be connected to the pad (or any component) that isn’t directly connected to it with a track. In the past, my work around is to place the vias and NOT fill (B) so that there is no border around the vias, thereby connecting the two layers. Not ideal for a few reasons. I’d like to come up with a better way.
My question is - what is the best way to connect a copper shape on one side of the PCB to a component on the other side, preferably in PCBNew and not eeschema, since I’m creating the shape in PCBNew. Should I just keep dong the “no fill thing”? Thanks!