I created a board that is planned to “stack” on top of a second pcb of the same design. This means that the current from Gnd on the first board needs to carry the current demands of the piggybacked pcb.
Of course I put Gnd Fills on both layers, and no dedicated trace to the opposite side of the board. Oh, yes, I had a dedicated trace, but as I kept the spacing for the Gnd Fills it became obvious that I did not actually need a dedicated trace; there is significantly more copper then needed.
The oversight was the small thermal reliefs on the connecting pads.
I know I can alter the Footprint assigned to the Pcb, but I’m not certain the best practice to fix this issue. Anyone been down this rabbit hole?