Thermal relief in vqfn and similar(multiple questions)

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Hi,
My first post here I think.
Migrated over from Eagle about a month or two ago.
I use KiCAD on my main PC (watercooled with a custom loop) and an ASUS Eeepc 1001pxd with lububtu. Strange enough I feel it runs better on the, much, weaker machine.

Anyway, to my questions:
I’ve managed two or three designs thus far (designs sent to board house).

In, one of them, current project I need vias between the pad (pin21) on a VQFN20 footprint and the bottom layer of the board. I did manage that using routing and swapping layers. I did not however manage to get the pad on the bortom side “solderable”, ie I want it free of soldermask and I would like more than 4 vias between the separate layers.

I am new to this software and I have not, yet, gotten familiar with the library structure. I haven’t opened the footprint editor yet lol.

I do like the software, schematics and layout is far better, once the “old habits” one has dies.

So a huge thanks the this amazing, AND FREE, software!

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If I understand you right you want to do smth like this

807×634 31.3 KB

if so, you need to make a copper pour on bottom and then use the same tool ( Add filled zones ) to make negative filled zone on back mask layer. This yellow zone now indicates solder mask free copper pour.

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Thank you!
That was exactly what I wanted.
So obvious, now that it’s been pointed out to me.
Again, thanks :slight_smile: