Hi all-
I’m getting this error: “Thermal relief Connection to zone incomplete: layer B.Cu; 1 spokes connected to isolated island”
I know this error has come up several times in the forum - but it seems like there are a couple of solutions - and since I’m an amateur in this field, I’m not sure what the best practice is.
The first option is to simply limit the number of spokes, which is 2 by default. It seems like for “simpler” circuits, setting this value to 1 is fine - but I’m not exactly sure why.
Another option seems to be simply rotating the spokes by 45 degrees. When I do this, it passes the DRC. However, the footprint/trace looks a little strange - is it necessary to re-route and re-fill the board after this rotation?
Yet another option is deselecting “thermal relief” (or what appears to be “From parent footprint” in my version) and selecting “solid” - in the Pad Connection menu.
Given these options, is there a sense of what to use where and when?
Thanks!