Thermal consistent trace for 0.6mm chip

Projects
1

Question 1: Do I need ‘thermally uniform copper trace’ for 3mm QFN so that it is heated up uniformly to allow solder reflow surface tension to have best-effect in pulling the chip into correct position.

Question 2, same for 0.6mm, 3 pins, leadless chip

With respect to three soldering process:

  1. 100 by 100mm 40 us dollars Aliexpress hot plate with little thermal mass. Switch on, ramming up from room temperature, human saw reflow, wait a little time, switch off hot plate. Human may manually change setup so that it is roughtly following the solder’s thermal profile. The machine can not track temperature profile automatically.

  2. Manual soldering by hot air

  3. Hot plate to pre-heat board and use manual hot air. What is a good pre-heat temperature for prototype using 63% tin, 37% lead solder paste.

In photo 1, all six pin pads have 0.5mm or more horizon-run before branching to other direction.

in photo 2, pin1 immediately branch off, without doing a consistent horizontal run of 0.5mm.

Many thanks

All pins run horizontally for 0.5mm
0_5mm_h_run

Here pin 1 run differently

pin1_vert_spread
pin1_vert_spread550×517 58.9 KB

0_6mm_3pin_leadless

2

This in not a KiCad related question so I have moved it to Projects.

There are better Forums to ask this kind of question but lets see what happens for a while . . .

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3

If you don’t have a huge plane over several layers on one pin soldering it with hand or hot air whith our without a pre-heated board is not an issue.

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