Strange behaviour on inner layer

[Marcell_Juhasz]

I hereby certify that I am not simply asking someone else to design a footprint for me.

Hey all!

I’ve come accross some strange error when designing my board. I have a 4 layer stackup, and the second inner layer (In2.Cu) behaves strangely with my custom-designed through-hole footprint.

If I connect some signal on every other layer, it works just fine, the signal track is connected as expected. But if I connect the signal the same way on In2.Cu, kicad marks it as “unconnected” for some reason.

Similarly, the second inner copper layer behaves strangely with the copper fills. Every layer connects to the ground copper fill as expected, with thermal relief. Except for In2.Cu, it does not connect to the copper fill, but leaves a small unfilled circle around the via.

This only happens with my custom footprint. If I use a simple 2.54 pitch pin header, every layer can connect to it the same way. This shows that the problem should be with my footprint. However, I cannot find my mistake, even when comparing my pad settings with e.g. the 2.54 pitch pinheader pad settings.

Can someone point me into the right direction? Thanks!

[Jonathan_Haas]

Some versions of Kicad had issues where copy-pasting a pad in the footprint editor would somehow affect its (invisible) inner layers. Try to delete that pad in the footprint editor and create a new identical one manually (without copying the old one) and see if the problems stay the same.