I have a couple of boards with an SSOP-28 package. The pads are 0.48 wide with 0.65 spacing.
For one boards I got a steel stencil from the PCB manufacturer, 0.12mm thick. This works nicely and lays down thin strips of solder on the pads. I can get it right first time and every time.
For the other board I got a 5mil (0.127mm) polyamide stencil from OSHStencils. With this I get too much paste on the pads, trying over and over different amounts of angle and pressure with no improvement.
Comparing the two stencils there is a small but noticeable difference in the gaps between the pad apertures with the steel stencil having a slightly larger gap.
I like the lower cost of the polyamide stencils but how can I handle this apparent difference? Should I be post-processing the paste Gerber file before sending it to OSHStencils to reduce the aperture sizes?