Solder Jumper Thermal Relief Gap not Honoured

Layout Footprints
1

I hereby certify that I am not simply asking someone else to design a footprint for me.

This is an auto-generated message that is in place on the “footprints” section of the KiCad.info forum. If I remove it and ask for a footprint to be designed anyway, I understand that I will be subject to forum members telling me to go design my own footprint or referring me to a 3rd party footprint site.

When adding a filled zone (GND plane), the thermal relief gap on the GND pad of the Rounded Solder Jumper (SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm) doesn’t seem to be honoured:

SolderJumperRounded

Switch to the non Rounded Solder Jumper (SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm), and it works ok:

SolderJumper

This is on the latest 9.0.1 build for Windows x64. I’ve also tried the latest Nightly, but it does the same.

No overrides are applied to the footprints. Is this a known issue, or am I doing something wrong?

2

These are the Pad Properties for that footprint:

image
image1082×660 31.9 KB

So this is clearly by design.

You can change this in your PCB.

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3

Ah, so it is. How odd. I wonder why it’s been done like that.

Thanks

4

You’re not doing anything wrong. This is a known issue that affects the RoundedPad version of the SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm footprint in KiCad. You did the right thing by switching to the non-rounded pad.

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