What is stackpole?
Why 0805 it’s huge.
0402 can handsolder with microscope (I am 54 and vision is no longer at its best)
0603 is walk in the park to hand solder.
10000 pcs 0402 is about 30 euro.
I never heard about price discussion on resistors before, you must all be running iPhone volumes.
Capacitors on the other hand can be very expensive.
Ceramic and poscap style.
Tell that a 60+ year old (not me) who wants to hand solder them here and there… 
I don’t have silkscreen REF or VAL on the pcb and place the 0805’s as tight as possible - compare that to a normal board where you got plenty of courtyard and all that silkscreen. Don’t think it’s much worse than 0603.
As for 0402… no thanks… if I let assemble for products that’s definitely on the table, but not for prototypes.
I use 0603, as the smallest that have value markings.
0805 seem to be gradually going away
0402 mounts perfectly on backside of a 1mm pitch bga.
Pads needs to be made non square to squeeze in between vias.
0201 mounts backside smaller pitch bga.
Usable for ddr3/4 adress termination for example.
Many designs would not be possible without them.
You can actually rework 0201 with microscope.
It’s quite doable.
I never went 01005 tough.
But I could make a footprint and throw into the layout for comparison, could be fun.
Traces and vias then becomes your biggest problem.
0.1/0.1mm is now more or less standard now.
I use 0.4 día pad and 0.2mm drill.
I think most manufacturers supports 0.35 / 0.2 without problems.
Thinner boards will probably be more common.
1.6nm is a bit too thick for 6 layers and below.
But but but…
Not under 1mm pitch bga I hope?
Remember.
Put in biggest possible cap = 0402
For 0402 thar would be 4.7u 6.3V X5R
Or 1u X7R, mostly for temperature range is better.
Probably 4V will be even better.
Forget the historical nonsense about mixed values.
Put your 1n, 10n, 100n in the trash bin where they belong.
Low esr, low inductance, big as possible values.
Never worse than X5R dielectric.
Avoid anything but ceramics.
Shouldn’t really be any need for anything else.
I don’t know why you had to battle for backside of bga caps.
It’s industry standard, the big guys do it also.
It doesn’t matter much where you place the caps for decoupling if your stackup and planes are in order.
But the real estate under the bga is free.
Also the vias are already there.
And yes, vias do cost money, not much of course, but why would you not use both the space and vias as they are already there.
Big gains even for resistors, yo be able to connect directly beneath and avoid a cumbersome fan out
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