What I am doing is designing different Printed Spark Gaps. My intention is to make a PCB with different shapes and study their behaviour before implementing them in a real project. That’s why I’m doing these footprints. I made them like SMD pad, then I should only put the solder paste in the pad area. Just had some curiosity about the layers.
If after explaining that someone think that the way I’m doing this is not correct, Im glad to listen other ways to do it.
Also, I made 2 weeks ago a post related to that for more info: