Hello All, Not sure if anyone does this from time to time, but I need to do some die to package studies and the wire bond is a point to point connection. I’ve written scripts to generate the die as a footprint and the package is a footprint of the lead-frame. I’m using vias to act as the bonding locations in both the die and package. It looks like this:
The issue I’m having is the following: If I use the routing tool and turn off the H/V/45 constants the wires are sill H/V/45 (assuming this is a bug in vers 9). If I use the line tool, this works but it will not snap to the via centers. It’s by no means a bit deal, but would like to know if I’m just missing something of if this seem like a real bug before I file something.
