Rigid-flex pcb fabrication process

Dear All,

Anybody can share the fabrication process involved in Rigid-flex pcb, I have got many information of rigid pcb fabrication and flex pcb fabrication, but got few flow charts represents rigid - flex fabrication, but not sufficient enough to get complete information. Is there any rigid flex fabrication details explained briefly.

Euro circuits has explained Rigid PCB manufacturing in detailed manner.
https://www.eurocircuits.com/making-a-pcb-pcb-manufacture-step-by-step/

My doubts begins under layer up and bonding sections. How exactly is done considering 10 layers rigid pcb, holding 8 layers of flex and 4 layer flex at the same time.

I think the exact process depends on the exact stackup, but in general it’s a combination of the rigid and flex fabrication processes – it’s all just a big stack of laminations after all! Can you clarify which parts you’re curious about? The bonding is typically done with acrylic adhesive.

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