I'm beginning with RF design, and I have a question.
I'm trying to follow Michael Ossman's suggestions.
In order to have a 50 Ohm (with OshPark 4 layers stackup), I have to design RF line with 0.30 mm of witdh.
When I see the footprint of a element ( for example, a SMA connector) suggested in the datasheet, I find that the RF signal pad is of X (whatever) mm.
Should I design the footprint of the element of the suggested width in all layers (F.Cu, F.Paste and F.MAsk)?
Or is the size of the pad referred only to F.Paste and F.Mask, so that I should design a F.Cu pad below with 0.30mm of width, in order to keep the 50 Ohm?