I’m struggling to mimic the recommended layout for a TI part. There are a few similar issues in other posts, but none have a solution that’s working for me.
You can see the zone polygon selected in the image below, but the actual copper poured is much smaller in a lot of weird ways. It’s nonexistent through the middle of the IC, and it narrows when going through the GND pads on all the parts it touches.
I’m not sure what the thin red outline is around the pads, but I thought it was the clearance for the pad. If so, I’d expect the copper pour to at least go up to it.
I guess most, or all of your issues are because of the zone properties itself.
First, change Pad connections / Thermal reliefs to Solid. Thermal reliefs do not make much sense for such a small zone, and the wide clearance for the thermal reliefs hinders your zone rendering.
But there is more. You guessed right for the thin read lines. They indicate the clearance around pads (You can also set this for tracks in the preferences). At the moment the clearance between the GND zone and the +24V net is a lot bigger then the clearance of the +24V net suggests it should be. The first thing to check for this is the clearance setting in the zone itself (see previous screenshot). If that does not work, then select both the zone and a pad from the +24V net and then: PCB Editor / Inspect / Clearance Resolution.
Just a note. I’ve learned for prototype boards, to never connect two pads either under the IC or right at the pads. Reason: Often if a change has to be made manually, if a trace is hidden under the IC you cannot modify it without removing the IC.
Also the recommended layout suggests a resistor between EN and Vin.
Clearly you’ve read the specifications in detail. Many don’t.
As for my personal rule to always keep IC connections its what I’ve learned over the years, even when I figured I would never need “that connection” I’ve been wrong / changed my mind etc. Oh and this only applies to prototype boards.
