I have a four layer board with the following layer stackup.
1> Top for signals
2> GND(Ground plane)
3> Power(3.3V)
4> Bottom for signals
The thing is that PCB design company has said that there are micro/blind vias in my design which are more complex and expensive to be designed, hence, my question is that how can I remove the microvias effectively with through hole vias.
The question is that to connect to inner two layers with through vias, how can I do it in KiCad.?
Someone told me that one can have clearance around the via for the layer not connecting to the via.
The following is an image where I had a microvia connecting to GND layer, which I have replaced with Through via. I am not sure that the via will connect to GND layer or not?
Is it the Annular rings option in image which can be changed to either “connected layers only” can solve the issue?
Right, that just means that there is a gap in the copper around the via so it doesn’t connect to other nets. KiCad adds clearance automatically between vias and zones of different nets, no need to worry about it, and usually no need to do anything manually.
The via from the screenshot has the GND net, so it will connect to all available GND fills it touches.
That option changes the behavior on layers where the net differs. Either the via has copper circles (annular rings) on all layers of the same size (and then the clearance around them where required), which is the default setting, or when using “connected layers only”, the copper circles are removed on layers where no connection is made and the clearance area will be closer around the via hole.
That doesn’t really solve a problem, regardless of the setting you will not have unwanted connection. Removing the annular rings just helps to improve connectivity in a copper plane if you have lots of vias that punch holes in it (making that hole size smaller).
