QFN packages with thermal pads generally require thermal vias and a cross-hatched solder paste stencil. For example this QFN 48 from TI:
Is there a way to define this right in the module/footprint editor?
If not, how would I add the cross-hatched stencil in the layout editor?
The way to do this is to add as many pads as you need for each features you describe. Pads just on the F.Paste layer and drills for the vias. Something like this (viewed in gerbv).
A bit clunky, but seems to work. Thanks!
Kasbah: I opened your module file but had trouble selecting the pads for paste. Please clarify what exists (for the central thermal area, not the fingers to the sides): five pads of type Through Hole (that overlap), and four pads of type (?) in the (?) layer for paste? All the pads have the same pin number (say 0 or 11).
I suppose the four pads for paste are of type SMD, sitting on top the TH type pads, and KiCad generates paste for them automatically?
Just so others might find this thread: similar packages also known as QFN, DFN, SON, VSON, MLF.
