There are horizontal versions of those ? - we have always avoided the vertical tine ones, for the exact reason you mention, of too weak in force tolerance.
Also note traces should exit on underside, or have many vias. Do not rely on plating to carry current, especially on physically stressed connections.
You could look at slots, & oval pads, to make the pins more press-fit. That reduces solder-span asks.
If you cannot use right angle ones, I see some have skewed tines on PCB top, to reduce wobble.
Including those in the solder plan, with a couple of vias might help.
Of course, physics says such a tine makes things stiffer, but also provides a fulcrum to deliver more force to the solder joint... hard to beat simple metal mass here - get the widest tines and thickest.. ?