I am modifying the hackrf one to include an Artix-7 FPGA for DSP purposes. I sent the gerber files off to a pcb fab in Taiwan for a prototype. They screen capped this picture:
asking if they could remove the non-function pad. The pad in question is a power trace to Vcc via for the MAX2837 in the hackrf rf frontend, as well as some GND vias and the thermal relief pads for the MAX2837’s exposed pad.
Could somebody please explain why the pads in question are non function pads.
(P.S: I have not made any changes to the rf section of the hackrf one, it is the same as in the original.)
Sounds like those pads aren’t connected to anything else, thus they want to remove it… you got the gerber files, what do they tell you when you look at them?
If it is an inner layer than the via might still go through but they want to remove the extra copper ring around it on the layer where nothing connects to it. (Or am i wrong here?)