I’m a bit confused about how to use layers when designing footprints for modules such as Arduino ProMini, BluePill, and other things like DC2DC converters, OLEDs, LCDs, etc.
These modules are made to be soldered using pin headers, or pin headers + pin sockets. Therefore, I use pin header footprints as a starting point. They come with : Silkscreen, Courtyard, and Fabrication layers. The pin headers outline is on the Fab layer.
I read the KLC, and had a look to the “Modules” library. These footprints consider that nothing can live underneath (Courtyard). This is untrue, in particular if pin sockets are used for mounting, and additionnal components are small sized. Therefore I use the headers courtyards.
KLC : “The fabrication layers are used to display the simplified mechanical outline of components on the PCB”. What layer should I use for the module outline ? It seems to me that the Dwgs.User is the one to use, as the module is not really on the PCB (only the pin headers/sockets are).
So, I did this :
- Silk, Courtyard, Fab : same as pin headers
- Dwgs.User for module outline
Is this correct ?
KLC : “footprint anchor should be placed at the location of Pin-1” (through hole components). Is this 100% mandatory ? I made all my modules centered at 0,0 not pin 1, and modifying all origins would be a pain (I already created a lot, and resetting the origin of all 3 D models, re-exporting, reconverting in KiCadStepup would be really tedious and time consuming : hundreds considering mounting variants and pin breakouts ! Some need 10-15mn of calculations in FreeCad !). Is all that work really needed for such components in order to get the “KiCad approved label” ? (I’d like to share, the reason why I ask these questions)