The pads for the MSOP-10 package are too long.
Suggested pad layout from Linear Technology data sheet
This causes board assembly problems at this fine pitch. There's only 0.195mm distance between pins. Because there's pad under the raised part of the pin, solder migrates there, and can form solder bridges. Those can't be removed easily, because they're under the raised pin area.
Is that a bad footprint? A footprint for a different class of part? Or what?
(Version info: Version: 4.0.6-e0-6349~53~ubuntu16.04.1 release build)