Please see screenshot
Originally, I had a wire from pad 3 to the center GND via. for both pad 3 and 12
But both are complaining about only one spoke ? I see two for pad3 , and one for pad 12
Please tell me how to resolve this correctly, yes I know that I can just exclude the violation.
I see a colour discrepancy on the right side of pad 3.
Layer problem?
Thermal reliefs are more for ensuring that a pad is not engulfed by the copper plane then to make sure the connection is still valid. If the thermal relief spokes can not be drawn automatically, then just draw some tracks manually. If I draw them manually, I usually connect them to a via or another pad to make sure there are no “open ends” and/or lock them in place, so they stay put where I put them.
One you see can be your track and not spoke.
Having such footprints, after finding that problem is only here I change minimum spoke number to 1.
I don’t use thermal relief for SMD devices . . . only through hole.
OK, hand soldering to a large area of 2 oz copper can be a challenge . . . but I’m only doing that for prototyping occasionally.
