Yeah, that's the footprint information. Everything there is obviously in millimeters and it's using a drafting syntax and notation that I'm not very fluent in. (My drafting tools still include the pen nibs for making your drawings permanent with India ink.)
Looks like the pads for the series current path are 3.1mm (125 mil) dia, with 1.6mm (63 mil) holes. They're spaced on a 2.54mm (100 mil) pitch, so the pads actually overlap. I'd be tempted to draft them as rounded rectangles, to keep the edges a continuous, smooth line.
The pads for the other signals seem to be 1.9mm (75 mil) dia with 1mm (39 mil) holes. That hole size seems a little large - they may be using a large hole to absorb tolerances in the module's packaging. I'd look at the package drawing and consider a smaller hole size - a size already in use elsewhere on your board. I wouldn't try to run any traces between those pads using the specified dimensions.