The usual method is:
- Place an SMT pad on the same copper layer as the graphics.
- press [Ctrl + e] twice to enter and exit the Pad Edit Mode.
It’s explained in more detail in:
But I do have doubts about the bigger picture. What is your overall intention with this footprint? My guess is that it is better to use a big SMT pad for the copper, and use aperture pads to control the amount of solder paste that gets deposited on the pad. If the solder paste layer is the same size as the copper, then there usually is far to much solder on the pads and this prevents proper soldering for packages like QFP and QFN.
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