How to allow microvia between two inner layers?

Hi, I’m routing an HDI PCB with “stacked microvia” . It’s a 8 layers PCB with microvia between L1 (top)-L2 and L2-L3. To make possible the microvia L2-L3 I create it on L1-L2 and modify manually the L1 to L3 layer.
Unfortunately the DRC add an error for each L2-L3 microvia (too many errors : more than 200 ).
Is It possible to hide those errors or allow the inner micro via?

Thanks for your support,

julien

PCBNEW release 5.1.5

In this way I don’t have DRC errors:

image

image

Hi,
With the same via’s design rules the error disappear.

I think is not “native” on PCBNEW to allow microvia between two inner layer.
Maybe on future release.

Thanks for your help.

Julien

Does it actually make any difference for production if you use blind/buried via instead of µvia in KiCad?

I going to send the project for analysis tomorrow to WE PCB. I will give you the WE answer.
For the routing it’s no natural, the micro via is allow for adjacent layer, for un blind / buried it’s only allow for L2-L7 (for an 8 layers for exemple). For the stacked via (my case) it’s another allowing. I don’t know on other software haw the stacked via are permitted.

These are so rare (read: expensive) technologies that virtually every time someone asks about them they are recommended to use basic technologies instead. Therefore I wouldn’t be surprised if this isn’t very mature feature in KiCad. It’s difficult to make the distinction between µ and blind/buried. Actually µvias should be blind or buried by nature because they can’t be drilled through the board, right? B/b can technically be either µ or non-µ if I’m not mistaken.

With quick testing it looks like it makes no different for gerber/drill output. Possibly you just have to use whatever produces the output you need and not care about the names.

This topic was automatically closed 90 days after the last reply. New replies are no longer allowed.