I just found and joined this forum because I have a newbie question. I’m making a PCB where I need to solder two wires (positive and negative) to exposed Cu traces. I’ve used the filled non-copper zones in the F.Mask layer to specify where I want the F.Cu to be exposed (no insulating overcoat). Then I would like to have these spots have solder paste on them for ease of soldering the wires. I think I need to add some filled zones in the F.Paste layer? But I can’t figure out how to do it - do I just draw a shape (e.g. a rectangle) in the F.Paste layer, or do I need to use a filled zone?
Paste is used only when you automatically assemble SMD. Do you?
Stencils are thin (0.1mm…0.2mm is not unusual). Imagine big, long hole in it.
I suppose openings in stencil are limited to only small dimensions as in other way the paste will be taken out of it by tool used to spread it.
I think I figured out how to do it - making the exposed Cu tinned (to make soldering wires to it easier) is what I want to do. I just need to check both F.Mask and F.Paste layers in “Non Copper Zone Properties”. I verified that now the copper is tinned - white color in the following image (it was yellow before checking the F.Paste layer).
Thanks for the replay. The SMD components on the PCB will be assembled by the PCB vendor; the exposed copper spots (pads) are where I will solder some wires to the PCB myself. I want the copper spots tinned for easier soldering.
If you need to solder two wires I suggest to use a footprint pads instead of a filled zone. Just create a fooprint pad from the Footprint editor with F.Mask checked. Here’s a modified R_0603 footprint as example
