I have designed a device that handle high current lines (~10A) and I want to expose the pcb lines that handles this current and add solder on them. (Through hole component on sided and SMD double sided here)
Should I create a solder mask only for those lines or should I create both the solder mask and the solder paste mask for those lines ?
Because my guess is that if the waves soldering assembly is used for through hole components, I can add the exposed lines to the solder mask only but if reflow technology assembly is used to solder through hole components, I have to add the exposed lines to both of the masks.
Is it correct ?
Is it a problem if waves soldering assembly is used and I expose the lines on both of the masks (solder mask and solder paste)?