I dont know how to continue here. Maybe I can use only few squared pads, and forget the semi circular area, or there is a way to generate a pad with that particular shape.
Instead of making outline pads, make them as solid areas. Import the dxf into the footprint editor, change the layer to F.Cu.
Then add a (tiny) pad from the editor onto each pad.
Now for each pad you have a tiny pad and a pad with your custom shape overlapped. The tiny pad will be the logical pad, the track should be connected to its centre. Be careful with the DRC, since it is likely the DRC will only check the tiny pad inside the custom shaped one.
I suspect that a reasonable approximation can be done by overlapping a pair of trapezoidal pads with a rectangle or two.
What is the technical justification for this pad shape? I’m guessing that the circular gap in the center is to avoid the “shorted turn”, or induced current, effect of placing copper directly under the inductor core, but there may be other reasons. Do the component contacts actually have this shape? Are they perhaps trying to increase copper area, for heatsinking? I suspect that straight-line approximations to the circle are quite adequate.
my point was only on the polygon pads, which I would like to know how to create, not on the fact that the suggested method would give a good approximation of the required pads (by the manufacturer DS).