I hereby certify that I am not simply asking someone else to design a footprint for me.
This is an auto-generated message that is in place on the “footprints” section of the KiCad.info forum. If I remove it and ask for a footprint to be designed anyway, I understand that I will be subject to forum members telling me to go design my own footprint or referring me to a 3rd party footprint site.
I’m using the LM7372 dual op-amp as part of my circuit, specifically the 8-pin SO PowerPad package. Rather than design my own, I thought to use a pre-built model from Digikey as shown in the picture below. The measurements match up, as well as TI’s 3D model, so I thought it would work well. The problem I’m facing is how to implement the exposed pad in the middle.
On the part’s datasheet below, page 3 says that the exposed pad should be tied to V- or left electrically floating. The same holds true with their 16-pin SOIC for their heatsink pins (1, 8, 9, and 16). Now, following their instructions, I would like to connected it to a floating piece of copper (a copper island). You can see how they did it with the 16-pin SOIC on page 17 as an example, but I was wondering how to implement it in KiCAD?
The component is on top of a ground plane, and when I add a copper pour and tie it to the op-amp’s center pad via its net name, nothing happened. I was expecting for the copper zones to allow for some clearance and leave a floating copper island, but it didn’t. For people who have seen these components before, how do you properly implement it in KiCAD?
Datasheet: TI Datasheet