i have an example board created where the ground pour connects to everything but an smd gnd pad. i am sure that some of the files will be required to receive some help; just not sure which ones since there are so many.
A screenshot of the area around the gnd pad in question would be a good start.
Or you could give use the .pcb_new file
(Having the complete project might help if the error is not inside the pcb_new file.)
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Is the ground pour using too thick spokes to reach the pad without violating DRC?
Is the pour on the same layer as the pad?
Either can be solved by manually adding a track to the pad and a via too if you need to change layer
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@davidsrsb, It was some combination of your first question. Changed the design rules and pour rules and reset the track to an adjacent pad for more space. All is good now thanks.