I have a two layer board with both pours on GND. Many pins on this chip are grounded and I’m trying to connect them via the top pour but also pull it back a bit so I can still easily solder the part. I don’t want thermal relief because this is an RF design and I want to avoid parasitic inductances to the ground plane. The pad connection setting is therefore set to Solid. Now when I pour, it claims to not be connected to ground even though the pads and the pour are clearly touching, especially the center pad. Any ideas what I am doing wrong?