However when I inspect the generated gerbers for the stencil I find a large circumference filled with paste but what I expect is just a corona instead. Or am I wrong?
It shows that your simple circular pad is on the copper layers and on F.Paste. To go forward, disable the F.Paste layer, and then add Aperture Pads for whatever features you want on the F.Paste layer.
Some considerations:
You want to cover the center hole to prevent it being filled with solder paste.
If more paste is needed, the aperture in the paste layer can be bigger then the copper pad. The solder paste will still wick towards the hole when the solder melts.
I’d consult with whoever is assembling the boards.
This is not an unusual thing, and they’ll be able to answer what the preferred paste maske should look like.
Thanks you all for the suggestions. Yes, it seems that the result is correct but I was initially shocked by the idea that there could be paste in a hole. Okay, I understand this and I will consider other options for the footprint.
My assembly house says this is good because, during the dispensing process, the ‘extra’ paste will eventually run down the walls of the metallised hole and strengthen the solder
Or, it could run into the standoff itself and ruin the thread. Stick to the recommended stencil opening; we’ve used it on thousands of these things without issue.
If you think carefully how the stencil is made and used you will understand why it’s impossible to have a circular “corona” there. Spokes like in the image by Rob is the only option if you don’t want paste in the hole.